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Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push

Written By: TDG Syndication
Last Updated: July 25, 2026 16:15:13 IST

By Heekyong Yang SEOUL, July 25 (Reuters) – Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and

(The article has been published through a syndicated feed. Except for the headline, the content has been published verbatim. Liability lies with original publisher.)

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