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Assam to host Rs 25,000 crore semiconductor packaging facility

On Thursday, Union Minister of State for Electronics and IT, Skill Development, and Entrepreneurship, Rajeev Chandrasekhar, revealed that Assam is on track to establish its inaugural semiconductor packaging facility, valued at approximately Rs 25,000 crore. He made this announcement during his address at the first-ever Digital India futureSKILLS Summit, which was held at the Birinchi […]

On Thursday, Union Minister of State for Electronics and IT, Skill Development, and Entrepreneurship, Rajeev Chandrasekhar, revealed that Assam is on track to establish its inaugural semiconductor packaging facility, valued at approximately Rs 25,000 crore.
He made this announcement during his address at the first-ever Digital India futureSKILLS Summit, which was held at the Birinchi Kumar Baruah Auditorium, Gauhati University.

“It was because of the leadership of Chief Minister Himanta Biswa Sarma, that a semiconductor packaging plant will be established in partnership with the Assam Government and TATA Group. We will soon obtain all approvals and submit it to the cabinet for final approval. Young Indians aspiring to enter the world of semiconductors won’t have to leave their state or travel to other cities anymore,” the Union Minister said.
The Minister also emphasised how India’s economy has undergone significant progress over the past decade, from being a ‘fragile 5’ to now ranked as the world’s ‘top 5’ economy.

“This significant milestone under the leadership of PM Narendra Modi has unleashed many opportunities for young Indians, particularly in emerging technology sectors where India is on the same starting line as the rest of the world. Through futureSKILLS, we want to convey to our young Indians that in the coming years, due to the policies of our Hon’ble PM Modi ji, numerous opportunities will open up for them,” the Minister said.

Students need to empower and equip themselves with skills in areas such as AI, cybersecurity, and semiconductors. Today, the world’s biggest companies in these fields, including NVIDIA, Intel, AMD, HCL, Wipro, and IBM, are present here today in Guwahati. They all share a singular message — there are tremendous job opportunities, but building skills for it is very important. The objective of this summit is to motivate young Indians to fully immerse themselves in the world of skills,” he added.
The Minister affirmed that with initiatives like future SKILLS, India is poised to lead the way in shaping the future of technology. This endeavor will cultivate a globally competitive talent pool accessible not only to Indian companies but also to organizations worldwide, setting a new standard in the global tech landscape.

“Our PM has created a three-pronged strategy to shape the future of tech — futureDESIGN for design innovation, futureLABS for innovation around systems, and futureSKILLS for preparing our Young Indians from Guwahati to Mumbai to Bengaluru to J&K with capabilities in emerging sectors. Today, Indians are very important players and participants in shaping the future of emerging technologies like AI, semiconductors, and cybersecurity,” Rajeev Chandrasekhar said.

The Digital India futureSKILLS Summit, hosted by the Ministry of Electronics and Information Technology (MeitY) through the National Institute of Electronics and IT (NIELIT), witnessed the convergence of esteemed dignitaries, industry leaders, academia, policymakers, and technology enthusiasts to deliberate on strategies for catalysing future-ready talent for India & the world.
Minister Chandrasekhar also highlighted that FutureSKILLS is about bringing to your attention the world of opportunities in areas that require many skilled people.

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